SUNNYVALE, Calif. — December 12, 2001 — The Electronic Device Group of
Mitsubishi Electric & Electronics USA, Inc., introduced a new series of 10 gigabit per
second (Gbps) distributed feedback (DFB) laser diodes for high-speed, high-volume Internet
communications in the North American market. The ML9XX18 series integrates an
electro-absorption (EA) modulator to create a 1550-nm wavelength light source that is
stable for short- and intermediate-reach data transmissions of up to 50 km. The series
offers customers a lower cost and smaller footprint alternative to products that use an
external lithium niobate modulator. It also meets the International Telecommunication
Union (ITU) S64.2 specification for 10-Gbps data transmissions.
"This series of DFB laser diodes brings integrated EA modulator cost savings to 50-km communications," said Daniel Chen, assistant vice president of high frequency products for Mitsubishi Electric & Electronics USA, Inc. "EA modulated DFB laser diodes also have the advantage of being a very compact 50-km communication solution."
Manufactured in indium gallium arsenide phosphate, the ML9XX18 series of laser diodes typically features a high extinction ratio of 11 decibels, a high side-mode suppression ratio of 40 decibels, and a fast response time of 30 picoseconds.
Packaging and Availability
The ML9XX18 has a chip-on-carrier type package. The ML9XX18 is now available in volume
production.
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About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation offers a diverse range of optoelectronic products for SDH,
SONET, DWDM, data communication, FITL, as well as passive optical network systems, test
and instrumentation applications, and CATV distribution. The company markets its
optoelectronic products in North America through the Electronic Device Group of Mitsubishi
Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including DRAM, flash, SRAM, ASIC, ASSP, MCU, microwave/RF, and optoelectronic devices.
Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/.
Trademark Information
Mitsubishi and the Mitsubishi logo are registered trademarks of Mitsubishi Electric
Corporation in the U.S.A., Japan, and other countries.
Keywords
Mitsubishi, optoelectronic, laser, DFB, 10 gigabit, network.
For More Information:
Positio Investor & Public Relations
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com
Mitsubishi Electric & Electronics USA, Inc.
John Garner
(408) 774-3191
garner_john@edg.mea.com
